On July 8, we held a kick-off event for SEED 2023.
We received video messages from Daita Company, a sponsor of this tour, the Embassy officials from SEED program participating countries, and participants and supporters from each university introduced themselves. Afterward, the students in smaller groups freely discussed their expectations for the SEED program and what they were looking forward to during the tour in Japan.
We appreciate the cooperation of everyone from Austral University, ESPM, FAAP, EAFIT University, and Los Andes University who attended the event and those who provided video messages to the students. As in 2022, the SEED 2023 program has talented students from Argentina, Brazil, and Colombia in the Latin American region, with diverse majors and personalities, such as international relations, engineering, business, design, and animation! Please continue to support our participating students over the next week and beyond✨
